World Fan-in Wafer Level Packaging Market 2016 Global Industry Analysis, Size, Share, Growth, Trends, and Forecast to 2020
ReportsnReports.com adds a new research report Global Fan-in Wafer Level Packaging Market 2016-2020. The report, Global Fan-in Wafer Level Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
This analyst forecast the global fan-in wafer level packaging market to grow at a CAGR of 9.63% during the period 2016-2020.
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Chip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.
This report covers the present scenario and the growth prospects of the global fan-in wafer level packaging market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor
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Key vendors
STATS ChipPAC
STMicroelectronics
TSMC
Texas Instruments
Other prominent vendors
Rudolph Technologies
SEMES
SUSS MicroTec
Ultratech
FlipChip International
Market driver
High demand for miniaturized electronics
For a full, detailed list, view our report
Market challenge
Cyclical nature of semiconductor industry
For a full, detailed list, view our report
Market trend
Increase in wafer size
For a full, detailed list, view our report
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