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Worldwide Semiconductor Packaging Equipment Market 2016 Geographical segmentation, Size, Trends, Growth and Forecasts

Thursday, November 17, 2016 2:07
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(Before It's News)

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components. 
Semiconductor packaging offers the following benefits to wafers:
- Prevents corrosion 
- Offers protection in case of impact
- Dissipates heat produced in the device
- Secures the contact leads or pins used to plug in the device to its external circuits

Publisher’s analysts forecast the global semiconductor packaging equipment market to grow at a CAGR of 8.04% during the period 2016-2020.

For more information about this report: http://www.reportsweb.com/global-semiconductor-packaging-equipment-market-2016-2020           

Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users – OSATs and IDMs.

The market is divided into the following segments based on geography: 
- APAC
- Europe
- North America

Publisher’s report, Global Semiconductor Packaging Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. 

Key vendors 
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu

 

Request Sample Copy at http://www.reportsweb.com/inquiry&RW0001374275/sample                     

 

Other prominent vendors 
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Ultratech

Market driver 
- High demand for polymer adhesive wafer bonding equipment
- For a full, detailed list, view our report 

Market challenge 
- Fluctuation of foreign exchange rates
- For a full, detailed list, view our report 

Market trend 
- Growing number of mergers and acquisitions
- For a full, detailed list, view our report 

Inquire for Report at http://www.reportsweb.com/inquiry&RW0001374275/buying   

 

Contact Us:

Call: +1-646-491-9876
Email: sales@reportsweb.com

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