The latest trending report Global Lead Frame Market by Manufacturers, Regions, Type and Application, Forecast to 2021 offered by DecisionDatabases.com in an informative study covering the market with detailed analysis. The report will assist reader with better understanding and decision making.
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Lead Frame, as the foundation of semiconductor packaging material, is a metal frame which provides support for an integrated circuit chip or die, and with the aids of bonding material (wire, aluminum wire, copper wire), lead frame is electrical lead to interconnect the integrated circuit on the die or chip to other electrical components or contacts. The main function of lead frame is for the circuit connection, heat dissipation, mechanical support, and so on.
Scope of the Report:
This report focuses on the Lead Frame in Global market, especially in North America, Europe and Asia-Pacific, Latin America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
• SH Materials
• Mitsui High-tec
• ASM Assembly Materials Limited
• Dynacraft industries
• LG Innotek
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Market Segment by Regions, regional analysis covers
• North America (USA, Canada and Mexico)
• Europe (Germany, France, UK, Russia and Italy)
• Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
• Latin America, Middle East and Africa
Market Segment by Type, covers
• Stamping Process Lead Frame
• Etching Process Lead Frame
Market Segment by Applications, can be divided into
• Integrated Circuit
• Discrete Device
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