High Density Interconnects Market analysis is provided for global market including development trends by regions, competitive analysis of high density interconnects market. High Density Interconnects (HDI) board is defined as a board (PCB) with a higher wiring density per Unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 μm), smaller vias (<150 μm) and capture pads (<400 μm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
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Market Segment by Manufacturers, this report covers
Scope of the Report:
This report focuses on the High Density Interconnects in Global market, especially in North America, High Density Interconnects Market in Europe and Asia-Pacific, High Density Interconnects Market in Latin America, High Density Interconnects Market in Middle and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Regions, regional analysis covers
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Market Segment by Type, covers
Market Segment by Applications, can be divided into
Key questions answered in the report:
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No. of Report pages: 111
Price of Report: $ 3480 (Single User Licence)
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