The Future of the Semiconductor Bonding Market Growth, And Research Report Breakdown

The global semiconductor bonding market size is projected to grow from USD 887 million in 2021 to USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026.The increasing adoption of stacked die technology in IoT devices is driving the growth of the semiconductor bonding market.

Advancements in the automotive sector, such as self-driven cars, connected vehicles, and electric vehicles, have increased the demand for MEMS, LEDs, photodiodes, image sensors, power devices, and other components. Moreover, due to the rising concerns regarding the safety of drivers and passengers, automobile manufacturers are also using MEMS and optoelectronics in a wide variety of passenger safety applications, such as airbag systems, vehicle dynamics systems, active suspension systems, and engine management systems. Such automotive assemblies require high-precision packaging, which can be done using bonding equipment. Thus, the implementation of technologically advanced bonding equipment for the assembly of vehicle electronics is expected to propel the growth of the semiconductor bonding market in the near future.

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APAC is expected to be the fastest-growing region for semiconductor bonding among the major regions. In 2020, South Korea held the largest share of the semiconductor bonding market in APAC. The dominance of South Korea is attributed to the presence of a large number of foundries, IDMs, and OSAT companies in the country. These companies use advanced bonding techniques and die bonding equipment for the assembly process of semiconductor components. A large number of foundries and fabrication plants of Samsung dedicated to the manufacturing of microprocessors, LEDs, DDR memory, and system logics also surges the demand for semiconductor bonding equipment in the country.

Moreover, the Chinese semiconductor bonding market is expected to witness a high CAGR during the forecast period owing to the increasing demand for miniaturized consumer electronic devices. Some of the manufacturers of semiconductor bonding equipment, such as ASM Pacific Technology Ltd. (Singapore) and Kulicke&Soffa (Singapore), have strengthened their presence in the country; this is expected to drive the semiconductor bonding market growth in the coming years.

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The semiconductor bonding market, by process type, has been segmented into die-to-die bonding, die-to-wafer bonding, and wafer-to-wafer bonding. Wafer-to-wafer bonding is expected to be the largest process type segment of the semiconductor bonding market with market size of USD 460.6 million in 2021. The growth of the wafer-to-wafer segment is driven by More than Moore (MtM) devices. The wafer-to-wafer segment is currently supported by CMOS image sensors (CIS) based on fusion bonding, which enables phase detection autofocus (PDAF) and faster shooting. However, the progress in the wafer-to-wafer segment is expected to be led mainly by potentially integrating hybrid bonding with no through-silicon vias (TSVs).