Global e-beam wafer inspection system market to grow at a CAGR of 20.2% during the period 2017-2021
The analysts forecast the global e-beam wafer inspection system market to grow at a CAGR of 20.2% during the period 2017-2021.
Electron beam (e-beam) wafer inspection system is a semiconductor fab equipment that is used during the semiconductor wafer manufacturing process to find defects in the wafers before packaging them. Apart from the production process, it is also used for R&D purposes. As the use of semiconductor wafers is prevalent in a large number of industries like consumer electronics, automotive, and industrial, the demand for e-beam wafer inspection systems is bound to grow during the forecast period.
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Covered in this report
The report covers the present scenario and the growth prospects of the global e-beam wafer inspection system market for 2017-2021. To calculate the market size, the report covers the shipment of e-beam wafer inspection equipment worldwide.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
The report, Global E-beam Wafer Inspection System Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• ASML Holding
• Hermes Microvision
• Hitachi High-Technologies
• Lam Research
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Market driver
• Increasing demand for semiconductor wafers
• For a full, detailed list, view our report
Market challenge
• High operation costs of e-beam wafer inspection system
• For a full, detailed list, view our report
Market trend
• Multi-beam e-beam inspection
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
• Market overview
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Semiconductor industry overview
• Semiconductor value chain
• Optical vs. e-beam wafer inspection system
• E-beam wafer inspection system market overview
• PEST Analysis
• Market size and forecast
• Five forces analysis
PART 06: Geographical segmentation
• E-beam wafer inspection system market in APAC
• E-beam wafer inspection system market in Americas
• E-beam wafer inspection system market in EMEA
PART 07: Market drivers
• Increasing demand for semiconductor wafers
• Increasing complexity of semiconductor wafer designs
• Increase in the use for R&D purposes
PART 08: Impact of drivers
PART 09: Market challenges
• High operation costs of e-beam wafer inspection system
• Difficult to find defects on an embedded chip
• Competition with optical inspection systems and long lifespan of e-beam wafer inspection systems
PART 10: Impact of drivers and challenges
PART 11: Market trends
..…..Continued
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