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Intel found new chassis manufacturing method to low cost ultrabooks by 65%.

Wednesday, July 11, 2012 1:13

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WorldWide
Tech & Science. Francisco De Jesùs.

Intel found new chassis manufacturing method to low cost ultrabooks by 65%.

Intel has found a new chassis manufacturing method from the automobile and
aerospace industries that can significantly reduce costs by 65%. The new
chassis is expected to appear in 2013, allowing the third-generation ultrabooks
to further drop their production costs, the sources pointed out.

In its latest Chip Shot (micro press-release), Intel announced a breakthrough in chassis design and structurally-rigid plastics, which can help Ultrabook manufacturers make chassis that are just as slim and durable as those made out of expensive materials, such as aluminum. Intel’s engineers deviced a reference-design Ultrabook chassis, which is a fraction of the cost, while being equivalent in “quality” (read: durability), to chassis that are machined out of blocks of aluminum, or die-cast metal.

Intel’s breakthrough doesn’t involve creation of newer materials than those widely available today, but ‘structural reduction analysis’ of the common Ultrabook chassis design, which achieves added strength to chassis designed using existing plastics. The way we understand it, Intel may have found ways to reinfoce sheets of ABS plastic that make up the body and bezels. Intel’s claim of the new plastic chassis being just as durable as metal ones is a particularly interesting one.

Intel announced that it will share the results of its work with its ecosystem partners (Ultrabook manufacturers), and products implementing the new innovation could be out by 2013, after further refinements. As long as it drives down costs, and doesn’t affect rigidity, we’re not complaining.

Borrowing engineering methodologies from the automotive and aerospace industries, Intel engineers have created an Ultrabook concept chassis that is a fraction of the cost and equivalent in quality to existing machined aluminum and die cast metal solutions in the market today. Intel said the breakthrough, which involved ‘structural reduction analysis’ to achieve added strength using existing plastics widely available today, would help lower the cost of Ultrabooks in the near future.The company said it would be sharing the results of its work with its ecosystem partners, and that Ultrabook systems using the new chassis designs would likely become available next year after further refinements in engineering and design.

Intel is expected to provide design suggestions for upcoming
third-generation Haswell-based ultrabooks that are aiming for release in the
second quarter of 2013, with suggestions including 3D displays, high quality
(HD) user interfaces and adoption of sensors are all expected.

With the addition of touchscreen control and
security measures and new component specifications such as chassis, battery,
hinge and solid state drive (SSD), the third-generation ultrabooks are expected
to further realize Intel’s design intents for ultrabook.

Read more at Worldwide Tech & Science

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