Discovery Will Mean Bendable Mobile Phones

Credit: ANU TV

“For the first time, we have developed an ultra-thin electronics component with excellent semiconducting properties that is an organic-inorganic hybrid structure and thin and flexible enough for future technologies, such as bendable mobile phones and display screens,” said Associate Professor Lu from the ANU Research School of Engineering.

PhD researcher Ankur Sharma, who recently won the ANU 3-Minute Thesis competition, said experiments demonstrated the performance of their semiconductor would be much more efficient than conventional semiconductors made with inorganic materials such as silicon.

“We have the potential with this semiconductor to make mobile phones as powerful as today’s supercomputers,” said Mr Sharma from the ANU Research School of Engineering.

“The light emission from our semiconducting structure is very sharp, so it can be used for high-resolution displays and, since the materials are ultra-thin, they have the flexibility to be made into bendable screens and mobile phones in the near future.”

The team grew the organic semiconductor component molecule by molecule, in a similar way to 3D printing. The process is called chemical vapour deposition.

“We characterised the opto-electronic and electrical properties of our invention to confirm the tremendous potential of it to be used as a future semiconductor component,” Associate Professor Lu said.

“We are working on growing our semiconductor component on a large scale, so it can be commercialised in collaboration with prospective industry partners.”

The work is published in Advanced Materials:
https://onlinelibrary.wiley.com/doi/abs/10.1002/adma.201803986

Contacts and sources:
Will WrightAustralian National University

Citation: Efficient and Layer-Dependent Exciton Pumping across Atomically Thin Organic-Inorganic Type-I Heterostructures
Linglong Zhang, Ankur Sharma, Yi Zhu, Yuhan Zhang, Bowen Wang, Miheng Dong, Hieu T. Nguyen, Zhu Wang, Bo Wen, Yujie Cao, Boqing Liu, Xueqian Sun, Jiong Yang, Ziyuan Li, Arara Kar, Yi Shi, Daniel Macdonald, Zongfu Yu, Xinran Wang, Yuerui Lu.. Advanced Materials, 2018; 30 (40): 1803986 DOI: 10.1002/adma.201803986