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CMOS Image Sensor Market by Technology CMOS Specification, Wafer & Sensor Size

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The research methodology used to estimate and forecast the market begins with capturing data on key vendor revenues through secondary research. The vendor offerings are also taken into consideration to determine the market segmentation. The bottom-up procedure was employed to arrive at the overall market size of the global CMOS image sensor market from the revenue of the key players in the market. After arriving at the overall market size, the total market was split into several segments and sub-segments which are then verified through primary research by conducting extensive interviews with key people such as CEOs, VPs, Directors and executives. This data triangulation and market breakdown procedures were employed to complete the overall market engineering process and arrive at the exact statistics for all segments and sub-segments.

The stakeholders of this report include foundry players, CMOS image sensor developers, ODM and OEM technology solution providers, research organizations, technology investors, technology standards organizations, associations, forums, and alliances related to CMOS image sensor, government bodies such as regulating authorities and policy makers, and investors.

The target audience for the report includes key players such as OmniVision Technologies Inc. (U.S), Samsung Electronics Co., Ltd. (South Korea), Sharp Corporation (Japan), SK Hynix Inc. (South Korea), and Sony Corporation (Japan), CMOSIS N.V. (Belgium), e2v technologies plc (U.K.), ON Semiconductor Corporation (U.S.), and Panasonic Corporation (Japan). Study answers several questions for the stakeholders, primarily which market segments to focus in next two to five years for prioritizing the efforts and investments.

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Scope of the report:

This research report categorizes the global CMOS image sensor market on the basis of technology, specification, wafer & sensor size, application, and region.

On the basis of technology:

The CMOS image sensor market has been segmented on the basis of technology into CMOS image sensor technology and other image sensor. The other image sensor technology includes a combination of CMOS and CCD, known as hybrid or sCMOS.

On the basis of specification:

The CMOS image sensor market has been segmented on the basis of specification into image processing type, spectrum, and array type. The image processing type has been subsegmented into 2D image sensor and 3D image sensor. The market on the basis of spectrum includes visible spectrum and non-visible spectrum. The market segmented on the basis of array type includes linear image spectrum and area image sensor.

On the basis of wafer and sensor size:

The CMOS image sensor market has been segmented on the basis of wafer and sensor size. The segmentation on the basis of wafer size includes 200mm, 300mm, and others. Other wafer sizes include those below 200mm and above 300mm. The sensor size segmentation includes medium format, full frame, APS-H and APS-C, 4/3inch, and 1inch and below. Only qualitative data for wafer and sensor size has given in the report.

On the basis of application:

The CMOS image sensor market has been segmented on the basis of application into aerospace, automotive, consumer electronics, healthcare, industrial, entertainment, security & surveillance, and others which include motion capture and barcode and document scanners.

On the basis of Region:

The global CMOS image sensor market has been segmented on the basis of region into four geographies, namely, the Americas, Europe, Asia-Pacific, and Rest of the World along with their respective countries.



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