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Liquid Encapsulation Market by Material Epoxy Resin & Epoxy-Modified Resin

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The semiconductor technology has rapidly evolved with the development of more advanced product and process technologies for various end users, applications, and verticals across the supply chain. For instance, according to Semiconductor Industry Association (2014); the worldwide sales for the semiconductors industry have increased from USD 77.3 Billion in 1993 to USD 305.6 Billion in 2013, with an average annual rate of increase of 7.11% per year.

Moreover, the WSTS Fall 2014 Semiconductor Industry Forecast predicts the worldwide semiconductor industry sales to reach USD 345 Billion in 2015 and USD 355 Billion in 2016. Some of the major growth drivers for the semiconductor industry are the upsurge in the consumer electronics market, growing investments from public and private firms, strong research initiatives, growing market for integrated circuits, and advancements in the sensors market among others.

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Electronics and semiconductor devices are made up of small components which need to be placed properly and accurately over the device; any misconnection or malfunctioning of these components can affect the functioning of the device. The liquid encapsulation technique plays a vital role in this. Threats such as misconnection of electronic components, managing complex structure without affecting the performance of device, and so on are handled efficiently with the help of liquid encapsulation materials.

The global liquid encapsulation market is projected to grow at a CAGR of 6.7% between 2015 and 2020, from an estimated value of USD 1,011.97 Million in 2015 to reach USD 1,397.46 Million by 2020. With regard to the various products considered for this market, integrated circuits are estimated to account for more than 75% of the total market till 2020. Similarly, electronics applications are considered to hold the major market share among all the applications till 2020.

The report on global liquid encapsulation materials also analyzes the value chain for the market. The global market has been segmented on the basis of material, product, application, and geography (Americas, Europe, APAC, and RoW). The report also evaluates various market trends and dynamics in the global market such as drivers, restraints, opportunities, and challenges.

This market research report profiles some of the key technological developments in the recent times. It also profiles some of the leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market ranking analysis of the key players. The global liquid encapsulation materials market also analyzes the major strategies adopted by the players to expand their geographic presence and to consolidate their position in the market.

The major players in the global liquid encapsulation market are Shin-Etsu Chemical Co., Ltd. (Japan), Sumitomo Bakelite Co., Ltd. (Japan), Hitachi Chemical Co. Ltd. (Japan), Henkel AG and Co. KGaA (Germany), Kyocera Corporation (Japan), Nagase & Co., Ltd. (Japan), Nitto Denko Corporation (Japan), Panasonic Corporation (Japan), BASF Se (Germany), Sanyu Rec Co. Ltd. (Japan), Resin Technical Systems (U.K.), and Epic Resins (U.S.) among others.



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