Chip Scale Package (CSP) LED Market by Application Backlighting Unit (BLU), Flash Lighting, General Lighting

Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a ceramic substrate, yielding a packaged LED or what is commonly referred to as an LED package. In the case of CSP LED, separate steps of having manufactured chips going through a packaging line are eliminated because at the die-level itself the chips are singulated and coated with phosphor. Solder or bond pads are installed at the wafer level just after the epitaxial stage of manufacturing using semiconductor etching and metallization techniques. CSP LEDs become ready for installation on a PCB after the wafer is diced. With no substrate and alloy/bonding wires to solder, CSP LEDs effectively omit production processes, which reduce the probability of making defective products. With several of the packaging steps omitted vis-à-vis a traditional LED package, the cost potential of a CSP LED is significantly lower, with a low bill of materials.

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Objectives of the Study

• To identify and analyze potential applications of CSP LEDs and traditional LED packages
• To define, describe, and forecast global LED package market based on different applications
• To define, describe, and forecast the chip-scale package (CSP) LED market, in terms of value, segmented on the basis of application, power range, and geography
• To analyze and forecast the CSP LED market, in terms of volume, segmented on the basis of application
• To provide market size estimation for North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW), along with respective countries, segmented on the basis of each application.
• To define and describe current and futuristic stages of CSP LED value chain and analyze the market based on player activities, developments, and capabilities
• To identify and analyze major factors (drivers, restraints, opportunities, and challenges) influencing the market growth
• To analyze key trends related to applications that are likely to shape and influence the market
• To strategically analyze micromarkets with respect to individual growth trends, prospects, and contributions to the total market
• To analyze opportunities in the market for stakeholders by identifying high-growth segments of the market
• To analyze strategic developments such as joint ventures, mergers & acquisitions, prototype developments, and R&D in the market
• To strategically profile key players and comprehensively analyze their market position in terms of ranking and core competencies, and detail the competitive landscape for market leaders

The value chain of the market includes input suppliers of wafers, manufacturing equipment, phosphor, and other raw materials; die/chip manufacturers, module integrators, and brand customers (end product manufacturer). Some of the major companies operating in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).