ITRI joins forces with TSMC and NYCU to develop next-gen MRAM technologies
Taiwan’s Industrial Technology Research Institute (ITRI) announced two new MRAM collaborations. The first one is with Taiwan’s TSMC, for the development of SOT-MRAM array chips. The second collaboration is with National Yang Ming Chiao Tung University (NYCU) to develop magnetic memory technology that can perform across a wide operating temperature range of nearly 400 degrees Celsius.
Together with TSMC, ITRI is developing low-voltage and current SOT-MRAM, that features high write efficiecny and low write voltage. ITRI says that its SOT-MRAM achieves a writing speed of 0.4 nanoseconds and a high endurance of 7 trillion reads and writes. The memory also offers a data storage lifespan of over 10 years.
Source: https://www.mram-info.com/itri-joins-forces-tsmc-and-nycu-develop-next-gen-mram-technologies
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